Downsized module, High frequency module, Passive embedded, Interposer, IC package etc., Applicable for various applications.

What is LTCC?

LTCC(Low Temperature Co-fired Ceramics) technology can realize multi-layer ceramic substrate co-fired both conductor and ceramics by lower temperature, less than 900°C
Alumina and Boron Silicate crystallized glass are sintered with silver(Ag) conductor. [KOA KLC specification]
Because of the ceramics base material, LTCC is superior in terms of heat and moisture tolerant. And in high frequency circuit, it has low loss high frequency performance.
Circuit pattern can be integrated on surface and inner layers to make multilayer structure. Low resistive conductor, silver, makes lower electrical loss , preferable for high frequency module and IC pacage and so on.

Feature of LTCC circuit board

Comparision with other technologies

LTCC substrate vs. HTCC (Alumina substrate) and FR4 (Resin substrate)

LTCC substrate has advantages for high density assembly and module downsizing by passive integration and bare chip assembly capability, additionally with the ceramics features of high frequency performance and high reliability of heat and moisture.

	Cavity Structure Passive integration and bare chip assembly capability

Structure of LTCC circuit board

Structure of LTCC circuit board

Example of LTCC module
Internal conductor circuit on each layer is connected by via holes. Inductive, capasitive circuit and strip line can be designed inside of the ceramics.

Manufacturing process

1. Ceramics and glass powder are mixed.
2. Resin binder and solvent is added and dispersed to make the slurry, which is base of the ceramics.
3. Slurry is spead on the PET film and dried in the oven to roll-up. This sheet raw ceramics is called "green sheet"
4. Green sheet is cut-out to the square shape.
5. Through holes are created to make via holes for electrical conductivity.
6. Via holes are filled and circuit pattern is printed on the green sheet.
7. Several layers are prepared and stacked to make multilayer circuit.
8. Sheet block is laminated and fired to make LTCC multilayer substrate.
9. Depending on requirements, substrate is plated or separated.

Manufacturing Process

LTCC substrate applications

1. Micro,mili range module, Bare-chip assembly module
2. Semiconductor device packaging, Interposor
3. Harsh environment(temperature, moisture) application
4. MEMS application

• *Please consider various applications by taking advantage of LTCC features.

Feature of KOA LTCC "KLC"

★Excellent shrinkage control creats smaller dimension deviation of lot-to-lot or in the lot.
★Precise stacking aquracy realize high dencity circuit.
★Flexibility of thickness, cavity shape

• *Customized design can be realized.Please find details in KLC page.

60GHz WLAN Module Substrate 27 x 12 mm	Cavity Package 6.5 x 5.5 mm

【Material characteristics overview】

【Design rule】