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LTCC substrate, Hybrid IC

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KOA's LTCC package is multilayer ceramics for various appliations including high density module, high frequency module, semiconductor interposer and cavity package. Hybrid IC enables downsizing and readily model changing as well as reduces inspection.

LTCC Substrate・Module

Multilayer ceramics for various applications including high density module, high frequency module, semiconductor interposer and cavity package.

Category Product Series Catalog
LTCC substrate•Package KLC PDF link of LTCC substrate/Package KLC
LTCC Module KLCJ PDF link of LTCC module KLCJ

Hybrid IC

Functional block in hybrid IC enables downsizing and readily model changing as well as reduces inspection processes.

Category Product Series Catalog
Custom Hybrid IC KA PDF link of custom hybrid KA

Common Specification

Items PDF
Minimum Ordered Quantity PDF link to Minimum Ordered Quantity
Recommended Pad Dimensions PDF link to Recommended Pad Dimensions
Packagings for Chip Components PDF link to Packagings for Chip Components
Axial Tapings PDF link to Axial Tapings
Radial Taping PDF link to Radial Taping
Forming PDF link to Forming
Color code•Resistance marking•E series numbers PDF link to Color code