New lineup of wire bonding compatible products added to platinum thin film thermal sensor
2025.11.28
To achieve mounting near power semiconductors and improve response speed
WTP
KOA's thermal sensor(chip type) lineup now includes
WTP, platinum thin film thermal sensor for wire bonding. This product features a back-side metallization structure that allows mounting via soldering or sintering.
Surface electrode of
WTP supports thick aluminum wire bonding with a maximum diameter of 300μmΦ.
The structure provides excellent dielectric strength voltage (AC2700Vrms when soaked in silicone oil) between the front and back surfaces, enabling mounting using the same process as bare power semiconductor chips, making it ideal for power modules temperature control. AEC-Q200 qualified.
Applications: Power module temperature control, high-precision temperature control for various sensors
Please contact us for details.
・To improve thermal response
・To iｍprove thermal runaway control performance
・To reduce mounting costs
・To reduce design costs