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KOA Corporation > Product > LTCC substrate, Hybrid IC

LTCC substrate, Hybrid IC

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KOA's LTCC package is multilayer ceramics for various appliations including high density module, high frequency module, semiconductor interposer and cavity package. Hybrid IC enables downsizing and readily model changing as well as reduces inspection.

LTCC Substrate

Multilayer ceramics for various applications including high density module, high frequency module, semiconductor interposer and cavity package.

Category Product Series Catalog
LTCC substrate•Package KLC PDF link of LTCC substrate/Package KLC

Hybrid IC

Functional block in hybrid IC enables downsizing and readily model changing as well as reduces inspection processes.

Category Product Series
Catalog
Custom Hybrid IC KA PDF link of custom hybrid KA
Multi Chip Module MCM PDF link of multi chip module MCM

Common Specification

Items Catalog
Minimum Ordered Quantity PDF link of Minimum Ordered Quantity
Recommended Pad Dimensions PDF link of Recommended Pad Dimension
Packagings For Chip Components PDF link of Packagings For Chip Components
Axial Tapings PDF link of Axial Tapings
Radial Taping PDF link of Radial Taping
Forming PDF link of Forming
Color code•Resistance marking•E series numbers PDF link of Color code•Resistance marking•E series numbers

Inventory
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